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Recent Updates
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iMAPS Updates with 3D Incites Content Platform and Microelectronics Foundation
IMAPS Academy Preview: Understanding the Cost of Fan-Out-Wafer-Level Packaging
Advanced Packaging Content Platform: 3D Incites Passes the Torch to iMAPS
IMAPS Microelectronics Foundation: Student engagement in the microelectronics and packaging industry
An Overview of Advanced Packaging Technology (Glass Substrate, 3D Pack, MR-MUF, MR-NCF, TSV, CoWoS)
The World of Advanced Packaging
IMAPS Device Packaging Conference: The Most Comprehensive Program for Microelectronics Packaging
IMAPS Around the World at IMAPS - Device Packaging Conference 2024
IMAPS Device Packaging Conference 2026 in Phoenix, Arizona. March 2-5, 2026
IMAPS Academy Preview: 3D Package and Assembly Technology
IMAPS All Asia Conference (IAAC)/Int'l Conference on Electronic Packaging (ICEP) Japan ~ April 2025
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Last Updated: August 18, 2026
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